Systems, circuits and methods related to low-loss bypass of a radio-frequency filter or diplexer

ABSTRACT

Disclosed are systems, circuits and methods related to low-loss bypass of a radio-frequency (RF) filter or diplexer. In some embodiments, a switching network circuitry can include a first switch that has an input pole configured to receive a radio-frequency (RF) signal, a pass-through throw configured to be connectable to the input pole to allow routing of the RF signal to an RF component, and at least one dedicated bypass throw configured to be connectable to the input pole and at least one bypass conduction path. The switching network circuitry can further include a second switch that has a pole and a throw, and is connectable between an output of the RF component and the bypass conduction path. Use of the dedicated bypass throw(s) in the first switch allows implementation of low-loss bypass of the filter or diplexer.

BACKGROUND

1. Field

The present disclosure generally relates to systems and methodsassociated with low-loss bypass of a radio-frequency filter or diplexer.

2. Description of the Related Art

In a radio-frequency (RF) system, a filter or diplexer is typicallyneeded or desired in some conditions. When not needed, it can bedesirable to bypass the filter or diplexer to avoid incurring lossassociated with the filter or diplexer.

SUMMARY

In accordance with a number of implementations, the present disclosurerelates to a switching network circuitry that includes a first switchhaving an input pole configured to receive a radio-frequency (RF)signal, a pass-through throw configured to be connectable to the inputpole to allow routing of the RF signal to an RF component, and at leastone dedicated bypass throw configured to be connectable to the inputpole and at least one bypass conduction path. The switching networkcircuitry further includes a second switch having a pole and a throw.The second switch is configured to be connectable between an output ofthe RF component and the bypass conduction path.

In some embodiments, the second switch can include at least onesingle-pole-single-throw (SPST) switch. The second switch can includeone SPST switch for each channel of the output of the RF component. Eachof the one or more SPST switches can be in an open state when thecircuitry is in a bypass mode, and in a closed state when the circuitryis in a pass-through mode.

In some embodiments, the first switch can be asingle-pole-multiple-throw (SPMT) switch such that the single pole isthe input pole and the multiple throws include the pass-through throwand the at least one dedicated bypass throw. In some embodiments, the RFcomponent can include a filter. In some embodiments, the at least onededicated bypass throw can include two or more throws. In someembodiments, the RF component can include a diplexer.

In some implementations, the present disclosure relates to asemiconductor die that includes a substrate configured to receive aplurality of components. The semiconductor die further includes aswitching network disposed on the substrate. The switching networkincludes a first switch having an input pole configured to receive aradio-frequency (RF) signal, a pass-through throw configured to beconnectable to the input pole to allow routing of the RF signal to an RFcomponent, and at least one dedicated bypass throw configured to beconnectable to the input pole and at least one bypass conduction path.The switching network further includes a second switch having a pole anda throw. The second switch is configured to be connectable between anoutput of the RF component and the bypass conduction path.

In some embodiments, the switching network can be implemented assilicon-on-insulator (SOI) process technology. In some embodiments, theswitching network can be implemented as pseudomorphichigh-electron-mobility transistor (pHEMT) process technology.

In a number of implementations, the present disclosure relates to aradio-frequency (RF) module that includes a packaging substrateconfigured to receive a plurality of components. The RF module furtherincludes a die mounted on the packaging substrate, with the die having aswitching network that includes a first switch having an input poleconfigured to receive a radio-frequency (RF) signal, a pass-throughthrow configured to be connectable to the input pole to allow routing ofthe RF signal to an RF component, and at least one dedicated bypassthrow configured to be connectable to the input pole and at least onebypass conduction path. The switching network further includes a secondswitch having a pole and a throw. The second switch is configured to beconnectable between an output of the RF component and the bypassconduction path. The RF module further includes a plurality ofconnectors configured to provide electrical connections between the dieand the packaging substrate.

In some embodiments, the die can be a silicon-on-insulator (SOI) die. Insome embodiments, the die can be a pseudomorphic high-electron-mobilitytransistor (pHEMT) die.

According to a number of teachings, the present disclosure relates to aradio-frequency (RF) device that includes a transceiver configured toprocess RF signals. The RF device further includes an antenna incommunication with the transceiver to facilitate transmission andreception of the RF signals. The RF device further includes a switchingnetwork implemented between the transceiver and the antennal andconfigured to route the RF signals. The switching network includes afirst switch having an input pole configured to receive an input signal,a pass-through throw configured to be connectable to the input pole toallow routing of the input signal to an RF component, and at least onededicated bypass throw configured to be connectable to the input poleand at least one bypass conduction path. The switching network furtherincludes a second switch having a pole and a throw. The second switch isconfigured to be connectable between an output of the RF component andthe bypass conduction path.

In some implementations, the present disclosure relates to a method forfabricating a device having a bypass architecture. The method includesforming or providing a switch that includes at least one throw dedicatedfor bypassing of a radio-frequency (RF) signal. The method furtherincludes forming or providing an RF component. The method furtherincludes connecting the at least one dedicated bypass throw to acorresponding conduction path that bypasses the RF component.

In some embodiments, the method can further include forming or providinga second switch at each of one or more output channels of the RFcomponent. In some embodiments, the RF component can include a filter.In some embodiments, the RF component can include a diplexer.

According to some implementations, the present disclosure relates to amethod for bypassing a radio-frequency (RF) component in a switchingnetwork. The method includes operating a first switch such that an RFsignal received at an input pole of the first switch is routed to abypass conduction path through a dedicated bypass throw. The operationof the first switch disconnects the RF component from the input pole ofthe first switch. The method further includes operating a second switchsuch that the RF component is disconnected from the bypass conductionpath.

In some embodiments, the RF component can include a filter. In someembodiments, the RF component can include a diplexer.

For purposes of summarizing the disclosure, certain aspects, advantagesand novel features of the inventions have been described herein. It isto be understood that not necessarily all such advantages may beachieved in accordance with any particular embodiment of the invention.Thus, the invention may be embodied or carried out in a manner thatachieves or optimizes one advantage or group of advantages as taughtherein without necessarily achieving other advantages as may be taughtor suggested herein.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B show pass-through and bypass modes of an architecturehaving one or more features described herein.

FIGS. 2A-2C show that the architecture of FIG. 1 can be implemented witha single-pole-multiple-throw (SPMT) switch to allow bypassing of one ormore channels associated with an RF component.

FIGS. 3A-3C show examples of RF components of FIG. 2A-2C.

FIGS. 4A and 4B show pass-through and bypass modes of a more specificexample of the configuration of FIG. 3B.

FIG. 5 shows an example of a current bypass architecture that requires aseparate switch to effectuate the bypass functionality.

FIG. 6 shows an example semiconductor die having a switching networkwith one or more features described herein.

FIG. 7 shows an example module that can include the die of FIG. 6 andthe RF component of FIGS. 1-3.

FIG. 8 shows an example RF device having a module that includes theswitching network of FIG. 6.

FIG. 9 shows an example process that can be implemented to fabricate adevice having a bypass architecture with one or more features describedherein.

FIGS. 10A and 10B show example processes that can be implemented toenable bypass and pass-through modes.

DETAILED DESCRIPTION OF SOME EMBODIMENTS

The headings provided herein, if any, are for convenience only and donot necessarily affect the scope or meaning of the claimed invention.

Disclosed herein are systems and methods related to improvingperformance in bypass circuits associated with some radio-frequency (RF)components such as an RF filter or an RF diplexer. Such an improvementcan include, for example, reduced loss of RF signals. Although variousexamples are described herein in the context of a diplexer, it will beunderstood that one or more features of the present disclosure can alsobe implemented in other applications such as a multiplexer. For thepurpose of description herein, the terms diplexer and multiplexer may beused interchangeably. Accordingly, unless specifically indicatedotherwise, a diplexer or a multiplexer can include two or more channels.

RF systems typically includes one or more filters and/or one or morediplexers. Such components typically are not used in all conditions.Thus, it is sometimes desirable to have RF signals bypass a filter or adiplexer when such functionality is not needed, so that extra systemloss associated with the filter or diplexer can be avoided. Currentarchitecture for achieving such a bypass typically involves addingseries switch elements for performing the bypass. However, such seriesswitching elements typically contribute to switch insertion loss.

Described herein are examples of bypass configurations whereadvantageous features such as reduction in insertion loss can beachieved. FIGS. 1A and 1B show a bypass architecture 100 that can beconfigured to be in a first state (FIG. 1A) and a second state (FIG.1B). The first state can correspond to a pass-through mode where an RFsignal passes through (depicted as dotted line 130) an RF device 104between a first node 1 and a second node 2 via conduction paths 110,112, 114, 116. Non-limiting examples of the RF device 104 are describedherein in greater detail. The second state can correspond to a bypassmode where an RF signal bypasses (depicted as dotted line 140) the RFdevice 104 via a conduction path 120.

In some implementations, the foregoing pass-through and bypass modes canbe facilitated by a switching network that includes first and secondswitch circuits S1 (102) and S2 (106). In some embodiments, the firstswitch 102 can be an input switch for the switching network. Variousnon-limiting examples of the first switch 102 are described herein ingreater detail. In some embodiments, the second switch 106 can beconfigured to provide improved isolation for each of one or more outputsof the RF device 104 when in the bypass mode. Examples of the secondswitch 106 are described herein in greater detail.

FIGS. 2A-2C show that in some implementations, the first switch 102 ofthe architecture 100 of FIG. 1 can be based on a single-pole-N-throw(SPNT) switch where N is a positive integer. One or more additionalthrows can be added to such a switch, where such added throw(s) can bededicated for providing bypassing functionality. For example, supposethat N is 5 so that an SP5T configuration provides regular switchingnetwork functionality. Then, adding two additional throws can yield anSP7T configuration where five arms facilitate the regular switchingnetwork functionality, and two remaining arms facilitate bypassfunctionality for the RF device. Other values of N, as well as thenumber of added throw(s) are possible; and various examples aredescribed herein.

In an example configuration 150 of the architecture 100 of FIG. 2A, oneadditional throw can be provided for the input switch to yield anSP(N+1)T switch 152. Such an added throw can be dedicated for bypassingof a single-channel RF device 104. Such a single-channel RF device canhave an input via a conductive path 112 and an output via a conductivepath 114. Thus, when in a pass-through mode, an RF signal can pass fromthe switch 152 via one of the N throws, to the RF device 104 via thepath 112, and be output from the RF device 104 via the path 114. When ina bypass mode, an RF signal can pass from the switch 152 via the addedthrow to a bypass path 120 to thereby bypass the RF device 104. FIG. 3Ashows a configuration 200 where the single-channel RF device 104 can be,for example, an RF filter 204.

In an example configuration 160 of the architecture 100 of FIG. 2B, twoadditional throws can be provided for the input switch to yield anSP(N+2)T switch 162. Such added throws can be dedicated for bypassing ofup to two channels of an RF device 104. Such a RF device can have aninput via a conductive path 112 and two outputs via conductive paths 114a, 114 b. Thus, when in a pass-through mode, an RF signal can pass fromthe switch 162 via one of the N throws, to the RF device 104 via thepath 112, and be output from the RF device 104 via the paths 114 a, 114b. When in a bypass mode, an RF signal can pass from the switch 162 viathe two added throws to either or both of bypass paths 120 a, 120 b tothereby bypass the RF device 104. FIG. 3B shows an example configuration210 where the RF device 104 can be, for example, a diplexer 214.

In an example configuration 170 of the architecture 100 of FIG. 2C,three additional throws can be provided for the input switch to yield anSP(N+3)T switch 172. Such added throws can be dedicated for bypassing ofup to three channels of an RF device 104. Such a RF device can have aninput via a conductive path 112 and three outputs via conductive paths114 a, 114 b, 114 c. Thus, when in a pass-through mode, an RF signal canpass from the switch 172 via one of the N throws, to the RF device 104via the path 112, and be output from the RF device 104 via the paths 114a, 114 b, 114 c. When in a bypass mode, an RF signal can pass from theswitch 172 via the three added throws to one or more of bypass paths 120a, 120 b, 120 c to thereby bypass the RF device 104. FIG. 3C shows anexample configuration 220 where the RF device 104 can be, for example, amultiplexer 224.

FIGS. 2 and 3 show that in some implementations, one or moresingle-pole-single-throw (SPST) switches can provide functionalitiesassociated with the second switch S2 (106) described in reference toFIG. 1. An SPST switch can be provided at an output of each channel ofthe RF device. Thus, in the example configuration 150 of FIG. 2A, anSPST switch 156 is shown to be provided at the single output of the RFdevice 104. In the example configuration 160 of FIG. 2B, SPST switches156 a, 156 b are shown to be provided at the two outputs of the RFdevice 104. In the example configuration 170 of FIG. 2C, SPST switches156 a, 156 b, 156 c are shown to be provided at the three outputs of theRF device 104. Example operating configurations of the SPST switches 156and the input switches (152, 162, 172) are described herein in greaterdetail.

FIGS. 4A and 4B show pass-through (250) and bypass (280) modes of anexample configuration 210 that can be a more specific example of theconfiguration described in reference to FIGS. 2B and 3B. The SP(N+2)Tswitch is shown to be an SP7T switch 252 configured to receive an inputRF signal at its single pole via a conductive path 260. Five (1, 2, 4,6, 7) of the seven throws are shown to provide regular switching networkfunctionality for the switch 252, including providing a pass-throughinput for the diplexer 214 through the fourth throw and conductive path112. The remaining two throws (3, 5) are shown to be connected to bypasspaths 120 a, 120 b. The bypass paths 120 a, 120 b are shown to beconnected to their respective output paths 270 a, 270 b.

The two output channels from the diplexer 214 are shown to be providedto conductive channel paths 114 a, 114 b. An SPST switch 156 a is shownto be interposed between the first channel path 114 a and the firstoutput path 270 a. Similarly, an SPST switch 156 b is shown to beinterposed between the second channel path 114 b and the second outputpath 270 b.

The example pass-through mode 250 of FIG. 4A can be implemented bysetting the switch 252 so that the input pole is connected to the fourththrow, and closing each of the SPST switches 156 a, 156 b. Accordingly,the conductive path 260 is interconnected to both of the paths 270 a,270 b to thereby facilitate the diplexer's operation.

The example bypass mode 280 of FIG. 4B can be implemented by setting theswitch 252 so that the input pole is connected to the fifth throw, andopening each of the SPST switches 156 a, 156 b. Accordingly, theconductive path 260 is interconnected to the second paths 270 b, and anRF signal between the two paths (260 and 270 b) bypasses the diplexer214. If the path 260 is to be interconnected to the first path 270 a,the switch 252 can be set so that the input pole is connected to thethird throw.

In either of the two foregoing bypassing examples, the SPST switchcorresponding to the interconnected output is opened, and the other SPSTswitch may or may not be opened. For example, in the first example wherethe second path 270 b is interconnected to the path 260, the second SPSTswitch 156 b is opened, and the first SPST switch 156 a may or may notbe opened. Similarly, in the second example where the first path 270 ais interconnected to the path 260, the first SPST switch 156 a isopened, and the second SPST switch 156 b may or may not be opened.

FIG. 5 shows an example configuration 300 of a current architecture forachieving a bypass of a diplexer 312 in the context of an example SP5Tswitch 302 that does not include any bypass-dedicated throw(s). The SP5Tswitch 302 is shown to have its third throw connected to a pathway 304that provides an input for a separate bypass switch 306.

The separate bypass switch 306 is shown to include three throws, withthe first and third throws connected to bypass paths 310 a, 310 b, andthe second throw connected to an input 308 for the diplexer 312. Each ofthe diplexer's two outputs (314 a, 314 b) is shown to be connected toone of the two throws of an output switch (316 a or 316 b). The otherthrow of the output switch is shown to be connected to the bypass path(310 a or 310 b). The pole of the output switch is shown to be connectedto an output path (318 a or 318 b).

Based on the comparison of the example architecture of FIG. 4 and theexample current architecture of FIG. 5, a number of differences can benoted. For example, in the example architecture 210 of FIG. 4, an RFsignal passes through two switches (SP7T and SPST) when in thepass-through mode, and only one switch (SP7T) when in the bypass mode.On the other hand, in the example architecture 300 of FIG. 5, an RFsignal passes through three switches (SP5T, SP3T and SP2T) in both ofthe pass-through and bypass modes. Thus, one can see that the examplearchitecture 210 of FIG. 4 advantageously has less number of separateswitches where insertion losses can occur. Such an advantage can be evenmore pronounced in a bypass mode, where an RF signal can encounter onlyone switch (e.g., SP7T) as opposed to three switches (e.g., SP5T, SP3Tand SP2T).

FIG. 6 shows that in some embodiments, a switching network 502 havingone or more features as described herein can be implemented on asemiconductor die 500. Such a switching network can be fabricated usingone or more process technologies. For example, a switching network canbe based on a network of field-effect transistors (FETs) fabricatedutilizing silicon-on-insulator (SOI) process technology. In anotherexample, a switching network can be based on a network of pseudomorphichigh-electron-mobility transistors (pHEMTs) implemented with galliumarsenide (GaAs) process technology. As described herein, the switchingnetwork 502 can include a single-pole-multiple-throw (SPMT) switch 504that includes one or more bypass throws 506 dedicated for bypassing ofsignals away from an RF component (not shown). Such a dedicated throw isshown to be connected to a bypass path 520 which is in turn connected toan output path 518. The SPMT switch 504 is shown to be connected to apath for connecting to the RF device.

As also described herein, the switching network 502 can also include oneor more SPST switches 508 to facilitate improved isolation when theswitching network 502 is in a bypass mode. The SPST switch 508 is shownto be connected to a path 514 for connecting to an output of the RFdevice. The SPST switch 508 is also shown to be connected to a path 516which is in turn connected to the output path 518. The paths 516 and 518can be connected to the pole and throw of the SPST switch 508.

FIG. 7 shows that in some embodiments, a die 500 having a switchingnetwork 502 with one or more features as described herein can be part ofa packaged module 550. The module 550 can also include an RF device 104such as a filter, diplexer or multiplexer as described herein. Theswitching network 502 and the RF device 104 can be interconnected (e.g.,by conductive paths 512 and 514 of FIG. 6) to provide functionalitiesdescribed herein. The module 550 can also include one or more bypasspaths to facilitate the bypassing functionality described herein. Themodule 550 can also include a packaging substrate such as a laminatesubstrate. The module 550 can also include one or more connections tofacilitate providing of signals to and from the die 500. The module 550can also include various packaging structures 554. For example, anovermold structure can be formed over the die 500 to provide protectionfrom external elements.

FIG. 8 shows that in some embodiments, a module 500 having a switchingnetwork 502 and an RF device 104 described herein can be included in anRF device 570 such as a wireless device. Such a wireless device caninclude, for example, cellular phone, a smart phone, etc. In someembodiments, the switching network 502 can be implemented in a packagedmodule such as the example of FIG. 7. The RF device 570 is depicted asincluding other common components such a transceiver circuit 572 and anantenna 576.

FIG. 9 shows a process 600 that can be implemented to fabricate a devicehaving a bypass architecture with one or more features as describedherein. In block 602, a switch having at least one additional throw canbe formed or provided. In block 604, an RF component such as a filterand/or a diplexer can be formed or provided. In block 606, at least oneadditional throw of the switch can be connected to at least oneconduction path that bypasses the RF component. In some implementations,the conduction path can be connected to an output path. In someimplementations, the process 600 can further include forming orproviding an SPST switch between an output of the RF component and theoutput path.

FIGS. 10A and 10B show example processes that can be implemented toswitch between pass-through and bypass modes as described herein. FIG.10A shows a process 610 that can be implemented to enable the bypassmode. In block 612, a bypass command can be generated. In block 614, aswitching signal can be issued. The switching signal can be based on thebypass command, and effectuate connection of a pole of a switch to athrow dedicated for bypassing of an RF signal.

FIG. 10B shows a process 620 that can be implemented to enable thepass-through mode. In block 622, a pass-through command can begenerated. In block 624, a switching signal can be issued. The switchingsignal can be based on the pass-through command, and effectuatedisconnection of a pole of a switch from a throw dedicated for bypassingof an RF signal.

Some examples herein are described in the context of asingle-pole-multiple-throw (SPMT) providing an input for an RFcomponent. For example, FIGS. 4A and 4B show paths where input is on theleft side of the SP7T switch and outputs are on the right side of thearchitecture. It will be understood that such directionality is simplyan example that facilitates the description. In some implementations, anarchitecture having one or more features described herein can bebi-directional. Such bi-directionality can apply to the architecture asa whole, or some portion thereof.

Some example switches are described herein in the context of asingle-pole configuration. It will be understood, however, that one ormore features of the present disclosure can also be implemented inswitches having more than one pole.

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense, as opposed to anexclusive or exhaustive sense; that is to say, in the sense of“including, but not limited to.” The word “coupled”, as generally usedherein, refers to two or more elements that may be either directlyconnected, or connected by way of one or more intermediate elements.Additionally, the words “herein,” “above,” “below,” and words of similarimport, when used in this application, shall refer to this applicationas a whole and not to any particular portions of this application. Wherethe context permits, words in the above Detailed Description using thesingular or plural number may also include the plural or singular numberrespectively. The word “or” in reference to a list of two or more items,that word covers all of the following interpretations of the word: anyof the items in the list, all of the items in the list, and anycombination of the items in the list.

The above detailed description of embodiments of the invention is notintended to be exhaustive or to limit the invention to the precise formdisclosed above. While specific embodiments of, and examples for, theinvention are described above for illustrative purposes, variousequivalent modifications are possible within the scope of the invention,as those skilled in the relevant art will recognize. For example, whileprocesses or blocks are presented in a given order, alternativeembodiments may perform routines having steps, or employ systems havingblocks, in a different order, and some processes or blocks may bedeleted, moved, added, subdivided, combined, and/or modified. Each ofthese processes or blocks may be implemented in a variety of differentways. Also, while processes or blocks are at times shown as beingperformed in series, these processes or blocks may instead be performedin parallel, or may be performed at different times.

The teachings of the invention provided herein can be applied to othersystems, not necessarily the system described above. The elements andacts of the various embodiments described above can be combined toprovide further embodiments.

While some embodiments of the inventions have been described, theseembodiments have been presented by way of example only, and are notintended to limit the scope of the disclosure. Indeed, the novel methodsand systems described herein may be embodied in a variety of otherforms; furthermore, various omissions, substitutions and changes in theform of the methods and systems described herein may be made withoutdeparting from the spirit of the disclosure. The accompanying claims andtheir equivalents are intended to cover such forms or modifications aswould fall within the scope and spirit of the disclosure.

1. A switching network circuitry comprising: a first switch thatincludes an input pole configured to receive a radio-frequency (RF)signal, a pass-through throw configured to be connectable to the inputpole to allow routing of the RF signal to an RF component, and at leastone dedicated bypass throw configured to be connectable to the inputpole and at least one bypass conduction path; and a second switch thatincludes a pole and a throw, the second switch configured to beconnectable between an output of the RF component and the bypassconduction path.
 2. The circuitry of claim 1 wherein the second switchincludes at least one single-pole-single-throw (SPST) switch.
 3. Thecircuitry of claim 2 wherein the second switch includes one SPST switchfor each channel of the output of the RF component.
 4. The circuitry ofclaim 3 wherein each of the one or more SPST switches is in an openstate when the circuitry is in a bypass mode, and in a closed state whenthe circuitry is in a pass-through mode.
 5. The circuitry of claim 1wherein the first switch is a single-pole-multiple-throw (SPMT) switchsuch that the single pole is the input pole and the multiple throwsinclude the pass-through throw and the at least one dedicated bypassthrow.
 6. The circuitry of claim 5 wherein the RF component includes afilter.
 7. The circuitry of claim 5 wherein the at least one dedicatedbypass throw includes two or more throws.
 8. The circuitry of claim 7wherein the RF component includes a diplexer.
 9. A semiconductor diecomprising: a substrate configured to receive a plurality of components;and a switching network disposed on the substrate, the switching networkincluding a first switch having an input pole configured to receive aradio-frequency (RF) signal, a pass-through throw configured to beconnectable to the input pole to allow routing of the RF signal to an RFcomponent, and at least one dedicated bypass throw configured to beconnectable to the input pole and at least one bypass conduction path,the switching network further including a second switch having a poleand a throw, the second switch configured to be connectable between anoutput of the RF component and the bypass conduction path.
 10. Thesemiconductor die of claim 9 wherein the switching network isimplemented as silicon-on-insulator (SOI) process technology.
 11. Thesemiconductor die of claim 9 wherein the switching network isimplemented as pseudomorphic high-electron-mobility transistor (pHEMT)process technology.
 12. (canceled)
 13. (canceled)
 14. (canceled) 15.(canceled)
 16. A method for fabricating a device having a bypassarchitecture, the method comprising: forming or providing a switch thatincludes at least one throw dedicated for bypassing of a radio-frequency(RF) signal; forming or providing an RF component; and connecting the atleast one dedicated bypass throw to a corresponding conduction path thatbypasses the RF component.
 17. The method of claim 16 further comprisingforming or providing a second switch at each of one or more outputchannels of the RF component.
 18. The method of claim 16 wherein the RFcomponent includes a filter.
 19. The method of claim 16 wherein the RFcomponent includes a diplexer.
 20. (canceled)
 21. (canceled) 22.(canceled)